The Helio X30 is also rumored to bet on the tri-cluster CPU design, with 2x Artemis cores at 2.8GHz, 4x Cortex-A53 at 2.2GHz, and 4x Cortex-A35 at 2GHz. The Artemis core by ARM design is the successor of the Cortex-A72 and should battle with Qualcomm’s Kryo solution. The A35 are extremely power efficient and offer up to 40% faster performance than their Cortex-A7 predecessor.
The Helio X30 should bring a powerful 4-core PowerVR 7XT GPU and support 26MP snappers, dual camera setups, VR connections, and LTE Cat.13.
Helio X30 manufactured by TSMC’s 10nm FinFET process, will be 100% more power efficient than its Helio X20 generation.
This chipset is billed to debut by early 2017